에스아이에스(주)

에스아이에스(주)
  • Business
  • Laser P. System
  • Laser Cutting System
  • Business

    Laser Processing System

    Laser Processing System

    Through SIS laser processing technology accumulated since its foundation,
    Maximize cost savings and productivity gains for your customers.

    • Laser Cutting System

      Laser cutting is a cutting method of focusing on the surface of an object to locally heat it for the momentary melting or evaporating state, and then blowing it with the gas jet, which is more efficient than the existing cutting methods.

      Laser cutting features non-contact processing to prevent abrasions, a reduced thermal strain and constitutional change, a vertical cutting face, and low surface roughness, that is, it does not require finishing after cutting.

      SIS corporation provides globally recognized laser cutting machines according to different customer requirements.

      Working range Max. 2000 x 4000mm
      Max. laser power Average 4kW
      Laser source Disk or Fiber laser
      Application 2D, 3D Cutting, Welding
      Options Welding optic
    • 2D Laser Machining Machine

      - Good price / performance ratio
      - No change lens module
      - High precision focus control

    • 2D Laser Machining Machine

      - Good price / Performance Ratio
      - No change lens module
      - High precision focus control

    Product inquiry
    • +82-52-245-5390
      sis@sisinc.co.kr